Digital Payments Growth: India Hits 99.7% Adoption, UPI at 85% Volume Share
Digital Payments Growth: India’s long-talked-about cashless economy is no longer just a slogan – RBI numbers now show it in hard data.…
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KEO launch: Karnataka unveils state-built AI-ready PC to tackle India’s digital divide
KEO launch: In a first-of-its-kind move by any Indian state, Karnataka has launched KEO, a compact, affordable and AI-ready personal computer designed…
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CSIR-ISRO Space Meet 2025: ISRO Chief Dr V. Narayanan Calls Gaganyaan a National Programme, Flags Next-Gen Human Spaceflight Priorities
India’s human spaceflight ambitions received a sharper strategic contour at the CSIR-ISRO Space Meet 2025, held on 17 November 2025 at Hotel…
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Digital Privacy & Data Protection in 2026: A Comparison of USA, EU & India
Digital Privacy & Data Protection: In 2026, digital privacy has become one of the most contested arenas in global policy. As data…
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Global AI Race 2026: How the USA, China & India Stack Up
Global AI Race 2026: As we move into 2026, the global race for artificial intelligence supremacy has entered a critical phase. This…
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Dual-Use Drones: BVLOS Pilots, New Norms and the Make-in-India Pipeline
Dual-Use Drones: In less than a decade, India has gone from a blanket ban on civilian drones in 2014 to positioning itself…
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Tele-ICU 2.0: AI Triage Meets Regulatory Guardrails as Hospitals Design Playbooks for 2026
Tele-ICU has moved from pandemic stop-gap to mainstream critical-care strategy. Studies in 2023–25 show that tele-ICU “hub-and-spoke” models—where a central team of…
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Post-Cookie Ads: Retail Media Networks Become the New Walled Gardens
Post-Cookie Ads: Retail Media Networks Become the New Walled Gardens for a decade, the open web ran on third-party cookies tiny trackers…
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Cell-Free Networks: Campus-to-Village Trials and the Fronthaul Math
Cell-free Networks massive MIMO is one of the boldest ideas in 6G: instead of a few tall towers with hard cell edges,…
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CoWoS Crunch Easing? Substrate Lead Times and the Real AI GPU Delivery Bottleneck
CoWoS Crunch Easing: For much of 2023–24, CoWoS—TSMC’s advanced “chip-on-wafer-on-substrate” packaging—was the villain behind AI GPU shortages. Cloud providers and model labs…
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